Kjøpe 021606.3MXESPP med BYCHPS
Kjøp med garanti
021606.3MXESPP
- Delenummer:
- 021606.3MXESPP
- Produsent:
- Littelfuse
- Beskrivelse:
- FUSE CERAMIC 6.3A 250VAC 5X20MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 20015 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 021606.3MXESPP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 021606.3MXESPP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 250V |
| Størrelse / Dimensjon: | 0.205" Dia x 0.787" L (5.20mm x 20.00mm) |
| Serie: | 216SP |
| Responstid: | Fast |
| emballasje: | Bulk |
| Pakke / tilfelle: | 5mm x 20mm (Axial) |
| Andre navn: | 0216063MXESPP 21606.3MXESPP F5734 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Smelting I²t: | 56.43 |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | 021606.3MXESPP |
| Sikringstype: | Cartridge, Ceramic |
| Beskrivelse: | FUSE CERAMIC 6.3A 250VAC 5X20MM |
| DC kald motstand: | 0.0137 Ohm |
| Nåværende vurdering: | 6.3A |
| Farge: | - |
| Brytekapasitet @ Nominell spenning: | 1.5kA |
| godkjenninger: | CE, CSA, CQC, KC, PSE, UR, VDE |
| Email: | [email protected] |
Beslektede deler til 021606.3MXESPP
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers