Kjøpe 135LC3600KL505HM6 med BYCHPS
Kjøp med garanti
135LC3600KL505HM6
- Delenummer:
- 135LC3600KL505HM6
- Produsent:
- Illinois Capacitor
- Beskrivelse:
- CAP FILM 1.32UF 10% 600VAC SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12339 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 135LC3600KL505HM6, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 135LC3600KL505HM6 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | - |
|---|---|
| Spenningsverdier - AC: | 600V |
| Toleranse: | ±10% |
| Avslutning: | - |
| Størrelse / Dimensjon: | 1.969" L x 1.969" W (50.00mm x 50.00mm) |
| Serie: | LC3 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 1572-1566 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | 135LC3600KL505HM6 |
| Lead Spacing: | - |
| Høyde - sittende (maks): | 1.339" (34.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 1.32µF ±10% Film Capacitor 600V Polypropylene (PP) Nonstandard |
| ESR (ekvivalent serieresistens): | 0.3 mOhm |
| Dielektrisk materiale: | Polypropylene (PP) |
| Beskrivelse: | CAP FILM 1.32UF 10% 600VAC SMD |
| kapasitans: | 1.32µF |
| applikasjoner: | Conduction Cooled; High Pulse, DV/DT |
| Email: | [email protected] |
Beslektede deler til 135LC3600KL505HM6
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers