Kjøpe 157DER2R5SCP med BYCHPS
Kjøp med garanti
157DER2R5SCP
- Delenummer:
- 157DER2R5SCP
- Produsent:
- Illinois Capacitor
- Beskrivelse:
- CAP 150F -20%, +50% 2.5V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19295 Pieces
- Dataark:
- 157DER2R5SCP.pdf
Introduksjon
BYCHIPS er strømprodusenten for 157DER2R5SCP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 157DER2R5SCP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | -20%, +50% |
| Avslutning: | - |
| Størrelse / Dimensjon: | 0.984" Dia (25.00mm) |
| Serie: | DER |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | 157DER2R5SCP |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Høyde - sittende (maks): | 2.224" (56.50mm) |
| Utvidet beskrivelse: | 150F -20%, +50%(EDLC) Supercapacitor 2.5V Radial, Can 22 mOhm 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | 22 mOhm |
| Beskrivelse: | CAP 150F -20%, +50% 2.5V T/H |
| kapasitans: | 150F |
| Email: | [email protected] |
Beslektede deler til 157DER2R5SCP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
127DCR2R3SLZ | Illinois Capacitor | CAP 120F -20%, +50% 2.3V T/H | Forespørsel |
 |
EDLNF155B5R5C | Cornell Dubilier Electronics (CDE) | CAP 1.5F 5.5V THROUGH HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers