Kjøpe 1N5809US med BYCHPS
Kjøp med garanti
1N5809US
- Delenummer:
- 1N5809US
- Produsent:
- Microsemi
- Beskrivelse:
- DIODE GEN PURP 100V 3A B-MELF
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13061 Pieces
- Dataark:
- 1N5809US.pdf
Introduksjon
BYCHIPS er strømprodusenten for 1N5809US, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 1N5809US via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 875mV @ 4A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 100V |
| Leverandør Enhetspakke: | B, SQ-MELF |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 30ns |
| emballasje: | Bulk |
| Pakke / tilfelle: | SQ-MELF, B |
| Driftstemperatur - Kobling: | -65°C ~ 175°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 7 Weeks |
| Produsentens varenummer: | 1N5809US |
| Utvidet beskrivelse: | Diode Standard 100V 3A Surface Mount B, SQ-MELF |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 100V 3A B-MELF |
| Strøm - Omvendt lekkasje @ Vr: | 5µA @ 100V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | 3A |
| Kapasitans @ Vr, F: | 60pF @ 10V, 1MHz |
| Email: | [email protected] |
Beslektede deler til 1N5809US
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers