Kjøpe 2.5DMB3R3M8X20 med BYCHPS
Kjøp med garanti
2.5DMB3R3M8X20
- Delenummer:
- 2.5DMB3R3M8X20
- Produsent:
- Rubycon
- Beskrivelse:
- CAP 3.3F 20% 2.5V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16898 Pieces
- Dataark:
- 2.5DMB3R3M8X20.pdf
Introduksjon
BYCHIPS er strømprodusenten for 2.5DMB3R3M8X20, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 2.5DMB3R3M8X20 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | DMB |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 1189-1161 25DMB3R3M8X20 |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | 2.5DMB3R3M8X20 |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.138" (3.50mm) |
| Høyde - sittende (maks): | 0.866" (22.00mm) |
| Utvidet beskrivelse: | 3.3F ±20%(EDLC) Supercapacitor 2.5V Radial, Can 1 Ohm @ 1kHz 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | 1 Ohm @ 1kHz |
| Beskrivelse: | CAP 3.3F 20% 2.5V THROUGH HOLE |
| kapasitans: | 3.3F |
| Email: | [email protected] |
Beslektede deler til 2.5DMB3R3M8X20
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers