Kjøpe 23A005 med BYCHPS
Kjøp med garanti
23A005
- Delenummer:
- 23A005
- Produsent:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 3W 400MA 55BT2
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17245 Pieces
- Dataark:
- 23A005.pdf
Introduksjon
BYCHIPS er strømprodusenten for 23A005, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 23A005 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 22V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Enhetspakke: | 55BT |
| Serie: | - |
| Strøm - Maks: | 3W |
| emballasje: | Bulk |
| Pakke / tilfelle: | 55BT |
| Driftstemperatur: | 200°C (TJ) |
| Støy Figur (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | 23A005 |
| Gevinst: | 8.5dB ~ 9.5dB |
| Frekvens - Overgang: | 4.3GHz |
| Utvidet beskrivelse: | RF Transistor NPN 22V 400mA 4.3GHz 3W Chassis Mount 55BT |
| Beskrivelse: | TRANS RF BIPO 3W 400MA 55BT2 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 100mA, 5V |
| Nåværende - Samler (Ic) (Maks): | 400mA |
| Email: | [email protected] |
Beslektede deler til 23A005
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
23A008 | Microsemi Corporation | TRANS RF BIPO 5W 400MA55BT2 | Forespørsel |
 |
BFQ67W,115 | NXP USA Inc. | TRANS NPN 10V 20MA 8GHZ SOT323 | Forespørsel |
 |
NE856M02-T1-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Forespørsel |
 |
BFR 182W E6327 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-323 | Forespørsel |
 |
RX1214B300Y,114 | Ampleon USA Inc. | TRANSISTOR RF LBAND SOT439A | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers