Kjøpe 28A0392-0A2 med BYCHPS
Kjøp med garanti
28A0392-0A2
- Delenummer:
- 28A0392-0A2
- Beskrivelse:
- FERRITE CORE 170 OHM HINGED
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13178 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28A0392-0A2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28A0392-0A2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 0.540" W x 0.540" H (13.72mm x 13.72mm) |
| Andre navn: | 240-2070 28A03920A2 CS0392B |
| Monteringstype: | Free Hanging |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | 28A0392-0A2 |
| Lengde: | 1.203" (30.56mm) |
| Innvendig dimensjon: | 0.192" Dia (4.88mm) |
| Impedans @ Frekvens: | 170 Ohm @ 100MHz |
| Utvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 170 Ohm @ 100MHz ID 0.192" Dia (4.88mm) OD 0.540" W x 0.540" H (13.72mm x 13.72mm) Length 1.203" (30.56mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 170 OHM HINGED |
| Email: | [email protected] |
Beslektede deler til 28A0392-0A2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
28A0392-0A0 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM HINGED | Forespørsel |
 |
FSRC222120RX000T | Murata Electronics North America | FERRITE CORE 53 OHM SOLID | Forespørsel |
 |
HFB143064-200 | Laird-Signal Integrity Products | FERRITE CORE HINGED | Forespørsel |
 |
74270010 | Wurth Electronics Inc. | FERRITE CORE 55 OHM SOLID 1.2MM | Forespørsel |
 |
28A0350-0B2 | Laird-Signal Integrity Products | FERRITE CORE 240 OHM HINGED | Forespørsel |
 |
LFB127079-000 | Laird-Signal Integrity Products | FERRITE CORE 25 OHM SOLID 7.92MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers