Kjøpe 28B1122-300 med BYCHPS
Kjøp med garanti
28B1122-300
- Delenummer:
- 28B1122-300
- Beskrivelse:
- FERRITE CORE 210 OHM SOLID
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18549 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28B1122-300, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28B1122-300 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Round |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 1.122" Dia (28.50mm) |
| Monteringstype: | Free Hanging |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | 28B1122-300 |
| Lengde: | 0.787" (20.00mm) |
| Innvendig dimensjon: | 0.542" Dia (13.77mm) |
| Impedans @ Frekvens: | 210 Ohm @ 100MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 210 Ohm @ 100MHz ID 0.542" Dia (13.77mm) OD 1.122" Dia (28.50mm) Length 0.787" (20.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 210 OHM SOLID |
| Email: | [email protected] |
Beslektede deler til 28B1122-300
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
28B1122-100 | Laird-Signal Integrity Products | FERRITE CORE 307 OHM SOLID | Forespørsel |
 |
ESD-R-12S | KEMET | FERRITE CORE SOLID 7MM | Forespørsel |
 |
28B1142-100 | Laird-Signal Integrity Products | FERRITE CORE 114 OHM SOLID 19MM | Forespørsel |
 |
FFAT-54 | API Delevan Inc. | FERRITE CORE 138 OHM TUBULAR 4MM | Forespørsel |
 |
28B1142-000 | Laird-Signal Integrity Products | FERRITE CORE 85 OHM SOLID 19MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers