Kjøpe 28R0984-200 med BYCHPS
Kjøp med garanti
28R0984-200
- Delenummer:
- 28R0984-200
- Beskrivelse:
- FERRITE CORE 170 OHM SOLID
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15946 Pieces
Introduksjon
BYCHIPS er strømprodusenten for 28R0984-200, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 28R0984-200 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Flat |
|---|---|
| Serie: | 28 |
| rangeringer: | - |
| Ytre dimensjon: | 0.984" W x 0.303" H (25.00mm x 7.70mm) |
| Andre navn: | 240-2324 28R0984200 |
| Monteringstype: | Free Hanging |
| Materiale: | 28 |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | 28R0984-200 |
| Lengde: | 0.630" (16.00mm) |
| Innvendig dimensjon: | 0.709" W x 0.035" H (18.00mm x 0.90mm) |
| Impedans @ Frekvens: | 170 Ohm @ 100MHz |
| Utvidet beskrivelse: | Solid Free Hanging Ferrite Core 170 Ohm @ 100MHz ID 0.709" W x 0.035" H (18.00mm x 0.90mm) OD 0.984" W x 0.303" H (25.00mm x 7.70mm) Length 0.630" (16.00mm) |
| Design: | Solid |
| Beskrivelse: | FERRITE CORE 170 OHM SOLID |
| Email: | [email protected] |
Beslektede deler til 28R0984-200
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
28R0906-000 | Laird-Signal Integrity Products | FERRITE CORE SOLID | Forespørsel |
 |
28B1417-200 | Laird-Signal Integrity Products | FERRITE CORE 115 OHM SOLID 23MM | Forespørsel |
|
28R0983-000 | Laird-Signal Integrity Products | FERRITE CORE 123 OHM SOLID | Forespørsel |
 |
28R0984-000 | Laird-Signal Integrity Products | FERRITE CORE 220 OHM SOLID | Forespørsel |
 |
74270036 | Wurth Electronics Inc. | FERRITE CORE 240 OHM SOLID 5.5MM | Forespørsel |
 |
CF1-9.5*4.8*20 | API Delevan Inc. | FERRITE CORE 171 OHM SOLID 4.8MM | Forespørsel |
 |
HFB150070-200 | Laird-Signal Integrity Products | FERRITE CORE 242 OHM SOLID | Forespørsel |
 |
HFB157070-000 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM SOLID | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers