Kjøpe 30R900UH med BYCHPS
Kjøp med garanti
30R900UH
- Delenummer:
- 30R900UH
- Produsent:
- Littelfuse
- Beskrivelse:
- PTC 9.00A 30V RESETTABLE KINK
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 20100 Pieces
- Dataark:
- 30R900UH.pdf
Introduksjon
BYCHIPS er strømprodusenten for 30R900UH, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 30R900UH via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Maks: | 30V |
|---|---|
| Type: | Polymeric |
| Tid til tur: | 20s |
| Tykkelse (Maks): | - |
| Størrelse / Dimensjon: | 0.950" L x 0.120" W (24.10mm x 3.00mm) |
| Serie: | POLY-FUSE®, 30R |
| Motstand - Posttur (R1) (Maks): | 20 mOhm |
| Motstand - Innledende (Ri) (Min): | 5 mOhm |
| Motstand - 25 ° C (Typ): | - |
| rangeringer: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Disc |
| Andre navn: | 030R0900 030R0900U 30R900 F2032 F2032-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | 30R900UH |
| Lead Spacing: | 0.402" (10.20mm) |
| Høyde - sittende (maks): | 1.240" (31.60mm) |
| Utvidet beskrivelse: | PTC Resettable Fuse 30V Ih Through Hole Radial, Disc |
| Beskrivelse: | PTC 9.00A 30V RESETTABLE KINK |
| Nåværende - tur (det): | 18A |
| Nåværende - Maks: | 40A |
| Nåværende - Hold (Ih) (Maks): | 9A |
| godkjenninger: | cURus, TUV |
| Email: | [email protected] |
Beslektede deler til 30R900UH
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers