Kjøpe 74LVX4245QSC med BYCHPS
Kjøp med garanti
74LVX4245QSC
- Delenummer:
- 74LVX4245QSC
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- TXRX TRANSLAT DUAL 8BIT 24QSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18644 Pieces
- Dataark:
- 74LVX4245QSC.pdf
Introduksjon
BYCHIPS er strømprodusenten for 74LVX4245QSC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74LVX4245QSC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 24-QSOP |
| Serie: | 74LVX |
| emballasje: | Tube |
| Pakke / tilfelle: | 24-SSOP (0.154", 3.90mm Width) |
| Utgangstype: | Push-Pull |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall elementer: | 1 |
| Antall bit per element: | 8 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | 74LVX4245QSC |
| Logikk Type: | Transceiver, Non-Inverting |
| Inngangstype: | - |
| Utvidet beskrivelse: | Transceiver, Non-Inverting Element 8 Bit per Element Push-Pull Output 24-QSOP |
| Beskrivelse: | TXRX TRANSLAT DUAL 8BIT 24QSOP |
| Nåværende - Utgang Høy, Lav: | 12mA, 12mA; 24mA, 24mA |
| Email: | [email protected] |
Beslektede deler til 74LVX4245QSC
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
74LVX4245QSCX | Fairchild/ON Semiconductor | IC TXRX DUAL 8BIT 3ST 24-QSOP | Forespørsel |
 |
74LVX4245MTCX | Fairchild/ON Semiconductor | TXRX 8-BIT DUAL 3STATE 24TSSOP | Forespørsel |
|
74LVX4245MTC | Fairchild/ON Semiconductor | TXRX 8-BIT DUAL 3STATE 24TSSOP | Forespørsel |
|
74LVX4245WMX | Fairchild/ON Semiconductor | IC TXRX TRANSL DUAL 8BIT 24-SOIC | Forespørsel |
|
74LVX4245WM | Fairchild/ON Semiconductor | IC TXRX 8BIT DUAL 3ST 24-SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers