Kjøpe 74SSTL16837ADGGRE4 med BYCHPS
Kjøp med garanti
74SSTL16837ADGGRE4
- Delenummer:
- 74SSTL16837ADGGRE4
- Produsent:
- Beskrivelse:
- IC UNIV BUS DVR 20BIT 64TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12900 Pieces
- Dataark:
- 74SSTL16837ADGGRE4.pdf
Introduksjon
BYCHIPS er strømprodusenten for 74SSTL16837ADGGRE4, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 74SSTL16837ADGGRE4 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 64-TSSOP |
| Serie: | 74SSTL |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 64-TFSOP (0.240", 6.10mm Width) |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall kretser: | 20-Bit |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | 74SSTL16837ADGGRE4 |
| Logikk Type: | Universal Bus Driver |
| Utvidet beskrivelse: | Universal Bus Driver 20-Bit 64-TSSOP |
| Beskrivelse: | IC UNIV BUS DVR 20BIT 64TSSOP |
| Nåværende - Utgang Høy, Lav: | 20mA, 20mA |
| Email: | [email protected] |
Beslektede deler til 74SSTL16837ADGGRE4
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
|
74SSTL16847DGGRE4 | Texas Instruments | IC BUFF TRI-STATE N-INV 64TSSOP | Forespørsel |
|
74SSTL16847DGGRG4 | Texas Instruments | IC BUFF TRI-STATE N-INV 64TSSOP | Forespørsel |
|
74SSTL16857DGGRG4 | Texas Instruments | IC SSTL2 REGISTERED BUFF 48TSSOP | Forespørsel |
|
74SSTL16837ADGGRG4 | Texas Instruments | IC UNIV BUS DVR 20BIT 64TSSOP | Forespørsel |
|
74SSTL16857DGGRE4 | Texas Instruments | IC REG BUFFER 14BIT 48-TSSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers