Kjøpe 80910300 med BYCHPS
Kjøp med garanti
80910300
- Delenummer:
- 80910300
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- FUSE HOLDER
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13932 Pieces
- Dataark:
- 80910300.pdf
Introduksjon
BYCHIPS er strømprodusenten for 80910300, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for 80910300 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 5 Weeks |
| Produsentens varenummer: | 80910300 |
| Utvidet beskrivelse: | Fuse Circuit |
| Beskrivelse: | FUSE HOLDER |
| Email: | [email protected] |
Beslektede deler til 80910300
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
80910310 | Eaton | FUSE HOLDER | Forespørsel |
|
80910060 | Eaton | FUSEHOLDER | Forespørsel |
 |
03455LF3X | Littelfuse Inc. | FUSE HLDR CART 250V 10A PNL MNT | Forespørsel |
|
BK/HTB-66-R | Eaton | FUSE HLDR CART 250V 20A PNL MNT | Forespørsel |
|
80910080 | Eaton | FUSEHOLDER | Forespørsel |
|
80910070 | Eaton | FUSEHOLDER | Forespørsel |
|
80910110 | Eaton | FUSEHOLDER | Forespørsel |
|
80910100 | Eaton | FUSEHOLDER | Forespørsel |
|
HM60200-3CR | Eaton | FUSE BLOCK CART 600V 200A SMD | Forespørsel |
 |
01000057H | Littelfuse Inc. | FUSE CLIP BLADE 125V 15A PCB | Forespørsel |
|
CH081DNI | Eaton | FUSE HLDR CART 400V 25A DIN RAIL | Forespørsel |
|
80910020 | Eaton | FUSEHOLDER | Forespørsel |
|
80910050 | Eaton | FUSEHOLDER | Forespørsel |
|
R25100-2COR | Eaton | FUSE BLOK CART 250V 100A CHASSIS | Forespørsel |
|
80910010 | Eaton | FUSEHOLDER | Forespørsel |
|
80910040 | Eaton | FUSEHOLDER | Forespørsel |
 |
02982005ZXT | Littelfuse Inc. | FUSE BLOK BLT DWN 32V 500A CHASS | Forespørsel |
|
80910030 | Eaton | FUSEHOLDER | Forespørsel |
|
0FNY0001XP | Littelfuse Inc. | FUSE HOLDER CART 32V 20A IN LINE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers