Kjøpe AD8137YCPZ-REEL7 med BYCHPS
Kjøp med garanti
AD8137YCPZ-REEL7
- Delenummer:
- AD8137YCPZ-REEL7
- Produsent:
- AD
- Beskrivelse:
- IC OPAMP DIFF 110MHZ RRO 8LFCSP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12434 Pieces
- Dataark:
- AD8137YCPZ-REEL7.pdf
Introduksjon
BYCHIPS er strømprodusenten for AD8137YCPZ-REEL7, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AD8137YCPZ-REEL7 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Single / Dual (±): | 2.7 V ~ 12 V, ± 2.7 V ~ 6 V |
|---|---|
| Spenning - Inngangsforskyvning: | 700µV |
| Leverandør Enhetspakke: | 8-LFCSP-WD (3x3) |
| Slew Rate: | 450 V/µs |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-WFDFN Exposed Pad, CSP |
| Utgangstype: | Differential, Rail-to-Rail |
| Andre navn: | AD8137YCPZ-REEL7-ND AD8137YCPZREEL7 |
| Driftstemperatur: | -40°C ~ 125°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | AD8137YCPZ-REEL7 |
| Utvidet beskrivelse: | Differential Amplifier 1 Circuit Differential, Rail-to-Rail 8-LFCSP-WD (3x3) |
| Beskrivelse: | IC OPAMP DIFF 110MHZ RRO 8LFCSP |
| Strøm - Forsyning: | 3.2mA |
| Strøm - Utgang / Kanal: | 20mA |
| Nåværende - Input Bias: | 500nA |
| Forsterkertype: | Differential |
| -3db Båndbredde: | 110MHz |
| Email: | [email protected] |
Beslektede deler til AD8137YCPZ-REEL7
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers