Kjøpe ADUC7024BCPZ62I med BYCHPS
Kjøp med garanti
ADUC7024BCPZ62I
- Delenummer:
- ADUC7024BCPZ62I
- Produsent:
- AD
- Beskrivelse:
- IC MCU 32BIT 62KB FLASH 64LFCSP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13769 Pieces
- Dataark:
- ADUC7024BCPZ62I.pdf
Introduksjon
BYCHIPS er strømprodusenten for ADUC7024BCPZ62I, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ADUC7024BCPZ62I via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 2.7 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 64-LFCSP-VQ (9x9) |
| Hastighet: | 44MHz |
| Serie: | MicroConverter® ADuC7xxx |
| RAM-størrelse: | 2K x 32 |
| Programminnetype: | FLASH |
| Programminnestørrelse: | 62KB (31K x16) |
| periferi~~POS=TRUNC: | PLA, PWM, PSM, Temp Sensor, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 64-VFQFN Exposed Pad, CSP |
| Oscillator type: | Internal |
| Driftstemperatur: | -40°C ~ 125°C (TA) |
| Antall I / O: | 30 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 7 Weeks |
| Produsentens varenummer: | ADUC7024BCPZ62I |
| Utvidet beskrivelse: | ARM7® MicroConverter® ADuC7xxx Microcontroller IC 16/32-Bit 44MHz 62KB (31K x16) FLASH 64-LFCSP-VQ (9x9) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT 62KB FLASH 64LFCSP |
| Datakonvertere: | A/D 10x12b; D/A 2x12b |
| Kjernestørrelse: | 16/32-Bit |
| Kjerneprosessor: | ARM7® |
| tilkobling: | EBI/EMI, I²C, SPI, UART/USART |
| Email: | [email protected] |
Beslektede deler til ADUC7024BCPZ62I
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers