Kjøpe AT91SAM9260B-CU med BYCHPS
Kjøp med garanti
AT91SAM9260B-CU
- Delenummer:
- AT91SAM9260B-CU
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- IC MCU 32BIT 32KB ROM 217BGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14857 Pieces
- Dataark:
- AT91SAM9260B-CU.pdf
Introduksjon
BYCHIPS er strømprodusenten for AT91SAM9260B-CU, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for AT91SAM9260B-CU via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 1.65 V ~ 1.95 V |
|---|---|
| Leverandør Enhetspakke: | 217-BGA (15x15) |
| Hastighet: | 180MHz |
| Serie: | AT91SAM |
| RAM-størrelse: | 24K x 8 |
| Programminnetype: | ROM |
| Programminnestørrelse: | 32KB (32K x 8) |
| periferi~~POS=TRUNC: | POR, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 217-LFBGA |
| Andre navn: | AT91SAM9260BCU |
| Oscillator type: | Internal |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall I / O: | 96 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 19 Weeks |
| Produsentens varenummer: | AT91SAM9260B-CU |
| Utvidet beskrivelse: | ARM9® AT91SAM Microcontroller IC 16/32-Bit 180MHz 32KB (32K x 8) ROM 217-BGA (15x15) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT 32KB ROM 217BGA |
| Datakonvertere: | A/D 4x10b |
| Kjernestørrelse: | 16/32-Bit |
| Kjerneprosessor: | ARM9® |
| tilkobling: | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSC, UART/USART, USB |
| Email: | [email protected] |
Beslektede deler til AT91SAM9260B-CU
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers