Kjøpe B32620A6122K med BYCHPS
Kjøp med garanti
B32620A6122K
- Delenummer:
- B32620A6122K
- Produsent:
- EPCOS
- Beskrivelse:
- CAP FILM 1200PF 10% 630VDC RAD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12423 Pieces
- Dataark:
- B32620A6122K.pdf
Introduksjon
BYCHIPS er strømprodusenten for B32620A6122K, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for B32620A6122K via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 630V |
|---|---|
| Spenningsverdier - AC: | 400V |
| Toleranse: | ±10% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | - |
| Serie: | B32620 |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | B32620A6122K000 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | B32620A6122K |
| Lead Spacing: | 0.295" (7.50mm) |
| Høyde - sittende (maks): | - |
| Egenskaper: | - |
| Utvidet beskrivelse: | 1200pF ±10% Film Capacitor 400V 630V Polypropylene (PP), Metallized - Stacked Radial |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized - Stacked |
| Beskrivelse: | CAP FILM 1200PF 10% 630VDC RAD |
| kapasitans: | 1200pF |
| applikasjoner: | High Pulse, DV/DT |
| Email: | [email protected] |
Beslektede deler til B32620A6122K
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
B32620A6153K | EPCOS (TDK) | CAP FILM 0.015UF 10% 630VDC RAD | Forespørsel |
 |
B32620A6152J189 | EPCOS (TDK) | CAP FILM 1500PF 5% 630VDC RADIAL | Forespørsel |
 |
B32620A6103J | EPCOS (TDK) | CAP FILM 10000PF 5% 630VDC RAD | Forespørsel |
 |
B32620A6681J | EPCOS (TDK) | CAP FILM 680PF 5% 630VDC RADIAL | Forespørsel |
|
B32620A6153J | EPCOS (TDK) | CAP FILM 0.015UF 5% 630VDC RAD | Forespørsel |
|
B32620A6152J | EPCOS (TDK) | CAP FILM 1500PF 5% 630VDC RADIAL | Forespørsel |
|
B32620A6123J289 | EPCOS (TDK) | CAP FILM 0.012UF 5% 630VDC RAD | Forespørsel |
|
B32620A6153K289 | EPCOS (TDK) | CAP FILM 0.015UF 10% 630VDC RAD | Forespørsel |
|
B32620A6152J289 | EPCOS (TDK) | CAP FILM 1500PF 5% 630VDC RADIAL | Forespørsel |
|
B32620A6103M289 | EPCOS (TDK) | CAP FILM 10000PF 20% 630VDC RAD | Forespørsel |
|
B32620A6153J289 | EPCOS (TDK) | CAP FILM 0.015UF 5% 630VDC RAD | Forespørsel |
|
B32620A6182J289 | EPCOS (TDK) | CAP FILM 1800PF 5% 630VDC RADIAL | Forespørsel |
|
B32620A6103K189 | EPCOS (TDK) | CAP FILM 10000PF 10% 630VDC RAD | Forespørsel |
|
B32620A6152K | EPCOS (TDK) | CAP FILM 1500PF 10% 630VDC RAD | Forespørsel |
|
B32620A6103J289 | EPCOS (TDK) | CAP FILM 10000PF 5% 630VDC RAD | Forespørsel |
|
B32620A6153K189 | EPCOS (TDK) | CAP FILM 0.015UF 10% 630VDC RAD | Forespørsel |
|
B32620A6152K289 | EPCOS (TDK) | CAP FILM 1500PF 10% 630VDC RAD | Forespørsel |
|
B32620A6153J189 | EPCOS (TDK) | CAP FILM 0.015UF 5% 630VDC RAD | Forespørsel |
|
B32620A6103K | EPCOS (TDK) | CAP FILM 10000PF 10% 630VDC RAD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers