Kjøpe BAW156E6327HTSA1 med BYCHPS
Kjøp med garanti
BAW156E6327HTSA1
- Delenummer:
- BAW156E6327HTSA1
- Beskrivelse:
- DIODE ARRAY GP 80V 200MA SOT23
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15759 Pieces
- Dataark:
- BAW156E6327HTSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for BAW156E6327HTSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BAW156E6327HTSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.25V @ 150mA |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 80V |
| Leverandør Enhetspakke: | PG-SOT23-3 |
| Hastighet: | Small Signal =< 200mA (Io), Any Speed |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 1.5µs |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Andre navn: | BAW 156 E6327 BAW 156 E6327-ND BAW 156 E6327TR-ND BAW156E6327 BAW156E6327BTSA1 BAW156E6327XT SP000010327 |
| Driftstemperatur - Kobling: | 150°C (Max) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BAW156E6327HTSA1 |
| Utvidet beskrivelse: | Diode Array 1 Pair Common Anode Standard 80V 200mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3 |
| Diodetype: | Standard |
| Diode Konfigurasjon: | 1 Pair Common Anode |
| Beskrivelse: | DIODE ARRAY GP 80V 200MA SOT23 |
| Strøm - Omvendt lekkasje @ Vr: | 5nA @ 75V |
| Gjeldende - Gjennomsnittlig Rectified (Io) (per diode): | 200mA (DC) |
| Email: | [email protected] |
Beslektede deler til BAW156E6327HTSA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers