Kjøpe BBY5705WE6327HTSA1 med BYCHPS
Kjøp med garanti
BBY5705WE6327HTSA1
- Delenummer:
- BBY5705WE6327HTSA1
- Beskrivelse:
- DIODE TUNING HIGH Q CC SOT-323
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15029 Pieces
- Dataark:
- BBY5705WE6327HTSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for BBY5705WE6327HTSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BBY5705WE6327HTSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 10V |
|---|---|
| Leverandør Enhetspakke: | PG-SOT323-3 |
| Serie: | - |
| Q @ Vr, F: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SC-70, SOT-323 |
| Andre navn: | BBY 57-05W E6327 BBY 57-05W E6327-ND BBY5705WE6327 BBY5705WE6327XT SP000012457 |
| Driftstemperatur: | -55°C ~ 125°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BBY5705WE6327HTSA1 |
| Utvidet beskrivelse: | Varactor 1 Pair Common Cathode 10V Surface Mount PG-SOT323-3 |
| Diodetype: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE TUNING HIGH Q CC SOT-323 |
| Kapasitansforhold: | C1/C4 |
| Kapasitansforhold: | 4.5 |
| Kapasitans @ Vr, F: | 5.5pF @ 4V, 1MHz |
| Email: | [email protected] |
Beslektede deler til BBY5705WE6327HTSA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BBY5702WH6327XTSA1 | Infineon Technologies | DIODE TUNING 10V 20MA SCD80 | Forespørsel |
 |
BBY5705WH6327XTSA1 | Infineon Technologies | DIODE TUNING 10V 20MA SOT323 | Forespørsel |
|
BB 659 E7908 | Infineon Technologies | DIODE VAR CAP 30V 20MA SCD-80 | Forespørsel |
 |
MMBV109LT3G | ON Semiconductor | DIODE TUNING SS 30V SOT-23 | Forespørsel |
 |
BBY5602VH6327XTSA1 | Infineon Technologies | DIODE TUNING 2SC79 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers