Kjøpe BZ055A683ZSB med BYCHPS
Kjøp med garanti
BZ055A683ZSB
- Delenummer:
- BZ055A683ZSB
- Produsent:
- AVX Corporation
- Beskrivelse:
- CAP 68MF -20% +80% 5.5V SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14546 Pieces
- Dataark:
- BZ055A683ZSB.pdf
Introduksjon
BYCHIPS er strømprodusenten for BZ055A683ZSB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BZ055A683ZSB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 5.5V |
|---|---|
| Toleranse: | -20%, +80% |
| Avslutning: | Solder Pads |
| Størrelse / Dimensjon: | 0.787" L x 0.591" W (20.00mm x 15.00mm) |
| Serie: | BestCap® BZ |
| emballasje: | Bulk |
| Pakke / tilfelle: | BZ05, 3 Lead |
| Andre navn: | 478-6278 |
| Driftstemperatur: | -20°C ~ 70°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | BZ055A683ZSB |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | - |
| Høyde - sittende (maks): | 0.240" (6.10mm) |
| Utvidet beskrivelse: | 68mF -20%, +80%(EDLC) Supercapacitor 5.5V BZ05, 3 Lead 125 mOhm 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | 125 mOhm |
| Beskrivelse: | CAP 68MF -20% +80% 5.5V SMD |
| kapasitans: | 68mF |
| Email: | [email protected] |
Beslektede deler til BZ055A683ZSB
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BZ055B333ZSB | AVX Corporation | CAP 33MF -20% +80% 5.5V SMD | Forespørsel |
 |
FC0V474ZFTBR24 | KEMET | CAP 470MF -20% +80% 3.5V SMD | Forespørsel |
 |
MAL219691124E3 | Vishay BC Components | CAP ALUM 4F 5.6V SNAP | Forespørsel |
|
BZ055B153ZSB | AVX Corporation | CAP 15MF -20% +80% 5.5V SMD | Forespørsel |
|
BZ055A333ZSB | AVX Corporation | CAP 33MF -20% +80% 5.5V SMD | Forespørsel |
 |
FC0H104ZFTBR24 | KEMET | CAP 100MF -20% +80% 5.5V SMD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers