Kjøpe BZ254B223ZSBCE med BYCHPS
Kjøp med garanti
BZ254B223ZSBCE
- Delenummer:
- BZ254B223ZSBCE
- Produsent:
- AVX Corporation
- Beskrivelse:
- CAP 22MF -20% +80% 4V SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14656 Pieces
- Dataark:
- BZ254B223ZSBCE.pdf
Introduksjon
BYCHIPS er strømprodusenten for BZ254B223ZSBCE, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for BZ254B223ZSBCE via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 4V |
|---|---|
| Toleranse: | -20%, +80% |
| Avslutning: | Solder Tabs |
| Størrelse / Dimensjon: | 0.787" L x 0.591" W (20.00mm x 15.00mm) |
| Serie: | BestCap® BZ |
| emballasje: | Bulk |
| Pakke / tilfelle: | BZ25, 3 Lead |
| Andre navn: | 478-5411 |
| Driftstemperatur: | -20°C ~ 70°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | BZ254B223ZSBCE |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | - |
| Høyde - sittende (maks): | 0.075" (1.90mm) |
| Utvidet beskrivelse: | 22mF -20%, +80%(EDLC) Supercapacitor 4V BZ25, 3 Lead 140 mOhm 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | 140 mOhm |
| Beskrivelse: | CAP 22MF -20% +80% 4V SMD |
| kapasitans: | 22mF |
| Email: | [email protected] |
Beslektede deler til BZ254B223ZSBCE
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EMHSR-0001C5-005R0 | NessCap Co Ltd | CAP 1.5F -10% +20% 5V T/H | Forespørsel |
 |
BCAP0650 P270 K04 | Maxwell Technologies Inc. | CAP 650F 2.7V THREADED | Forespørsel |
 |
BCAP0100 P270 T07 | Maxwell Technologies Inc. | CAP 100F 2.7V THROUGH HOLE | Forespørsel |
 |
PM-5R0H105-R | Eaton | CAP 1F -20% +80% 5V T/H | Forespørsel |
 |
FR0H223ZF | KEMET | CAP 22MF -20% +80% 5.5V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers