Kjøpe CDLC401K2R7SR med BYCHPS
Kjøp med garanti
CDLC401K2R7SR
- Delenummer:
- CDLC401K2R7SR
- Produsent:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP 400F -5% +10% 2.7V T/H
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12917 Pieces
- Dataark:
- CDLC401K2R7SR.pdf
Introduksjon
BYCHIPS er strømprodusenten for CDLC401K2R7SR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CDLC401K2R7SR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | -5%, +10% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | 1.378" Dia (35.00mm) |
| Serie: | CDLC |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Snap-In |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | CDLC401K2R7SR |
| Levetid @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Høyde - sittende (maks): | 2.800" (71.00mm) |
| Utvidet beskrivelse: | 400F -5%, +10%(EDLC) Supercapacitor 2.7V Radial, Can - Snap-In 3.2 mOhm 1000 Hrs @ 65°C |
| ESR (ekvivalent serieresistens): | 3.2 mOhm |
| Beskrivelse: | CAP 400F -5% +10% 2.7V T/H |
| kapasitans: | 400F |
| Email: | [email protected] |
Beslektede deler til CDLC401K2R7SR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
EDLRG105H3R6C | Cornell Dubilier Electronics (CDE) | CAP 1F -20% +80% 3.6V T/H | Forespørsel |
 |
EEC-HZ0E106 | Panasonic Electronic Components | CAP 10F -20% +40% 2.5V T/H | Forespørsel |
 |
JJC0E128MSEFBB | Nichicon | CAP 1200F 20% 2.5V CHASSIS MOUNT | Forespørsel |
 |
DHL-5R5D473T | Elna America | CAP 47MF -20% +80% 5.5V T/H | Forespørsel |
 |
107DER2R5SBG | Illinois Capacitor | CAP 100F -20%, +50% 2.5V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers