Kjøpe CGA-3318Z med BYCHPS
Kjøp med garanti
CGA-3318Z
- Delenummer:
- CGA-3318Z
- Produsent:
- RFMD
- Beskrivelse:
- IC AMP CATV HBT SIGE DUAL 8ESOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19706 Pieces
- Dataark:
- CGA-3318Z.pdf
Introduksjon
BYCHIPS er strømprodusenten for CGA-3318Z, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CGA-3318Z via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Single / Dual (±): | 3.9 V ~ 4.3 V |
|---|---|
| Leverandør Enhetspakke: | 8-ESOP |
| Slew Rate: | - |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Utgangstype: | Push-Pull |
| Antall kretser: | 2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | CGA-3318Z |
| Beskrivelse: | IC AMP CATV HBT SIGE DUAL 8ESOP |
| Strøm - Forsyning: | 150mA |
| Strøm - Utgang / Kanal: | - |
| applikasjoner: | CATV |
| -3db Båndbredde: | - |
| Email: | [email protected] |
Beslektede deler til CGA-3318Z
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
LMH6722MA | Texas Instruments | IC OP AMP QUAD VIDEO 14-SOIC | Forespørsel |
|
THS7313PW | Texas Instruments | IC BUFFER VIDEO 3CH 20-TSSOP | Forespørsel |
 |
CGA-6618 | RFMD | IC AMP CATV HBT GAAS DUAL 8-ESOP | Forespørsel |
|
BUF01901AIDRCT | Texas Instruments | IC PROG VOLTAGE SOURCE 10VSON | Forespørsel |
 |
CGA-0116Z | RFMD | IC CATV SPLITTER 3-OUT 16-TSSOP | Forespørsel |
 |
NJM2576RB1-TE1 | NJR Corporation/NJRC | IC VIDEO AMP W/LPF LO-VOLT 8TVSP | Forespørsel |
 |
HA5023IB96 | Intersil | IC OPAMP DUAL 125MHZ VIDEO 8SOIC | Forespørsel |
|
CGA-3318 | RFMD | IC AMP CATV HBT SIGE DUAL 8ESOP | Forespørsel |
 |
BGY588N,112 | NXP USA Inc. | IC PUSH-PULL AMP 550MHZ SOT115J | Forespørsel |
|
CGA-0116 | RFMD | IC CATV SPLITTER 3-OUT 16-TSSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers