Kjøpe CYDD18S36V18-200BBXC med BYCHPS
Kjøp med garanti
CYDD18S36V18-200BBXC
- Delenummer:
- CYDD18S36V18-200BBXC
- Produsent:
- Cypress Semiconductor
- Beskrivelse:
- IC SRAM 18MBIT 200MHZ 256FBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12940 Pieces
- Dataark:
- CYDD18S36V18-200BBXC.pdf
Introduksjon
BYCHIPS er strømprodusenten for CYDD18S36V18-200BBXC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for CYDD18S36V18-200BBXC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V |
|---|---|
| Leverandør Enhetspakke: | 256-FBGA (17x17) |
| Hastighet: | 200MHz |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 256-LBGA |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Minnetype: | Volatile |
| Minnestørrelse: | 18Mb (256K x 36 x 2) |
| Minneformat: | SRAM |
| Produsentens varenummer: | CYDD18S36V18-200BBXC |
| Interface: | Parallel |
| Beskrivelse: | IC SRAM 18MBIT 200MHZ 256FBGA |
| Email: | [email protected] |
Beslektede deler til CYDD18S36V18-200BBXC
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CYDD18S72V18-200BBXC | Cypress Semiconductor Corp | IC SRAM 18MBIT 200MHZ 256FBGA | Forespørsel |
|
CYDD18S36V18-167BBXI | Cypress Semiconductor Corp | IC SRAM 18MBIT 167MHZ 256FBGA | Forespørsel |
|
CYDD18S36V18-167BBXC | Cypress Semiconductor Corp | IC SRAM 18MBIT 167MHZ 256FBGA | Forespørsel |
 |
MTFC16GLWDQ-4M AIT Z TR | Micron Technology Inc. | IC FLASH 128GBIT 100LBGA | Forespørsel |
|
CYDD18S72V18-167BBXI | Cypress Semiconductor Corp | IC SRAM 18MBIT 167MHZ 256FBGA | Forespørsel |
|
CYDD18S72V18-167BBXC | Cypress Semiconductor Corp | IC SRAM 18MBIT 167MHZ 256FBGA | Forespørsel |
 |
FM22L16-55-TG | Cypress Semiconductor Corp | IC FRAM 4MBIT 55NS 44TSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers