Kjøpe DBR70510F med BYCHPS
Kjøp med garanti
DBR70510F
- Delenummer:
- DBR70510F
- Produsent:
- Cynergy3
- Beskrivelse:
- RELAY REED SPST-NC 3A 5V
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18327 Pieces
- Dataark:
- DBR70510F.pdf
Introduksjon
BYCHIPS er strømprodusenten for DBR70510F, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DBR70510F via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 3.7 VDC |
|---|---|
| Slå av spenning (Min): | 0.5 VDC |
| Oppsigelsesstil: | PC Pin, Wire Leads |
| Bryter spenning: | 1000VAC, 1000VDC - Max |
| Serie: | D |
| Frigjør tid: | 3ms |
| Relé Type: | Reed |
| emballasje: | Tray |
| Andre navn: | DBR70510F-ND |
| Driftstemperatur: | -20°C ~ 70°C |
| Bruk tid: | 2ms |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | DBR70510F |
| Egenskaper: | - |
| Utvidet beskrivelse: | Reed Relay SPST-NC (1 Form B) 5VDC Coil Through Hole |
| Beskrivelse: | RELAY REED SPST-NC 3A 5V |
| Kontakt Rating (Nåværende): | 3A |
| Kontaktmateriale: | Rhodium (Rh) |
| Kontakt skjema: | SPST-NC (1 Form B) |
| Spolespenning: | 5VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 38 Ohms |
| Coil Power: | - |
| Coil Current: | 131.5mA |
| Email: | [email protected] |
Beslektede deler til DBR70510F
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DBR70510 | Cynergy 3 | RELAY REED SPST-NC 3A 5V | Forespørsel |
 |
DBR70510F-HR | Cynergy 3 | RELAY REED SPST-NC 3A 5V | Forespørsel |
 |
DBR70510S | Cynergy 3 | RELAY REED SPST-NC 3A 5V | Forespørsel |
 |
DBR70510-HR | Cynergy 3 | RELAY REED SPST-NC 3A 5V | Forespørsel |
 |
DBR70510P | Cynergy 3 | RELAY REED SPST-NC 3A 5V | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers