Kjøpe DDLC2R5LGN142KBF0S med BYCHPS
Kjøp med garanti
DDLC2R5LGN142KBF0S
- Delenummer:
- DDLC2R5LGN142KBF0S
- Produsent:
- Nippon Chemi-Con
- Beskrivelse:
- CAP 1400F 10% 2.5V CHASSIS MOUNT
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12369 Pieces
- Dataark:
- DDLC2R5LGN142KBF0S.pdf
Introduksjon
BYCHIPS er strømprodusenten for DDLC2R5LGN142KBF0S, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for DDLC2R5LGN142KBF0S via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | ±10% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | 1.575" Dia (40.00mm) |
| Serie: | DLCAP™, DLC |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Screw Terminals |
| Andre navn: | 565-3258 |
| Driftstemperatur: | -25°C ~ 60°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | DDLC2R5LGN142KBF0S |
| Levetid @ Temp.: | 2000 Hrs @ 60°C |
| Lead Spacing: | 0.669" (17.00mm) |
| Høyde - sittende (maks): | 6.063" (154.00mm) |
| Utvidet beskrivelse: | 1400F ±10%(EDLC) Supercapacitor 2.5V Radial, Can - Screw Terminals 2.5 mOhm 2000 Hrs @ 60°C |
| ESR (ekvivalent serieresistens): | 2.5 mOhm |
| Beskrivelse: | CAP 1400F 10% 2.5V CHASSIS MOUNT |
| kapasitans: | 1400F |
| Email: | [email protected] |
Beslektede deler til DDLC2R5LGN142KBF0S
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
DDLC2R5LGN351KA65S | United Chemi-Con | CAP 350F 10% 2.5V CHASSIS MOUNT | Forespørsel |
 |
EDLSG105V5R5C | Cornell Dubilier Electronics (CDE) | CAP 1F 5.5V THROUGH HOLE | Forespørsel |
 |
DX-5R5V334U | Elna America | CAP 330MF -20% +80% 5.5V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers