Kjøpe E36D551CPN332MFE3M med BYCHPS
Kjøp med garanti
E36D551CPN332MFE3M
- Delenummer:
- E36D551CPN332MFE3M
- Produsent:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM 3300UF 20% 550V SCREW
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15944 Pieces
- Dataark:
- E36D551CPN332MFE3M.pdf
Introduksjon
BYCHIPS er strømprodusenten for E36D551CPN332MFE3M, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for E36D551CPN332MFE3M via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier: | 550V |
|---|---|
| Toleranse: | ±20% |
| Surface Mount Land Size: | - |
| Størrelse / Dimensjon: | 3.500" Dia (88.90mm) |
| Serie: | U36D |
| Ripple Current: | 7.76A @ 120Hz |
| polarisering: | Polar |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Screw Terminals |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | E36D551CPN332MFE3M |
| Levetid @ Temp.: | 2000 Hrs @ 85°C |
| Lead Spacing: | 1.250" (31.75mm) |
| impedans: | - |
| Høyde - sittende (maks): | 5.625" (142.88mm) |
| Utvidet beskrivelse: | 3300µF 550V Aluminum Capacitors Radial, Can - Screw Terminals 88 mOhm @ 120Hz 2000 Hrs @ 85°C |
| ESR (ekvivalent serieresistens): | 88 mOhm @ 120Hz |
| Beskrivelse: | CAP ALUM 3300UF 20% 550V SCREW |
| kapasitans: | 3300µF |
| applikasjoner: | General Purpose |
| Email: | [email protected] |
Beslektede deler til E36D551CPN332MFE3M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers