Kjøpe EFG20G med BYCHPS
Kjøp med garanti
EFG20G
- Delenummer:
- EFG20G
- Produsent:
- Crydom
- Beskrivelse:
- MODULE SCR/DIODE 140A 530VAC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16351 Pieces
- Dataark:
- 1.EFG20G.pdf2.EFG20G.pdf
Introduksjon
BYCHIPS er strømprodusenten for EFG20G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for EFG20G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Off State: | 1400V |
|---|---|
| Spenning - Gate Trigger (Vgt) (Maks): | 3V |
| Struktur: | 3-Phase Controller - SCRs/Diodes |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | Module |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| Antall SCR, Diodes: | 3 SCRs, 3 Diodes |
| Monteringstype: | Chassis Mount |
| Produsentens varenummer: | EFG20G |
| Utvidet beskrivelse: | SCR Module 1400V 125A (DC) 3-Phase Controller - SCRs/Diodes Chassis Mount Module |
| Beskrivelse: | MODULE SCR/DIODE 140A 530VAC |
| Nåværende - På Stat (Det (RMS)) (Maks): | 125A (DC) |
| Gjeldende - Ikke Rep. Surge 50, 60Hz (Itsm): | 1960A @ 60Hz |
| Nåværende - Gate Trigger (Igt) (Maks): | 150mA |
| Email: | [email protected] |
Beslektede deler til EFG20G
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
VS-VSKN56/04 | Vishay Semiconductor Diodes Division | MODULE THYRISTOR 60A ADD-A-PAK | Forespørsel |
 |
MCD162-14IO1 | IXYS | MOD THYRISTOR/DIODE 1400V Y4-M6 | Forespørsel |
 |
F1827SDK1600 | Crydom Co. | MODULE SCR/DIODE 25A 600VAC | Forespørsel |
 |
B512FSE-2T | Crydom Co. | MOD DIODE SCR 25A 240VAC .250"QC | Forespørsel |
 |
VS-P103 | Vishay Semiconductor Diodes Division | MOD BRIDGE CC 25A 800V D-19 | Forespørsel |
 |
M5010012F | Crydom Co. | MODULE POWER 100A 600V SCR CC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers