Kjøpe ER1025-56KR med BYCHPS
Kjøp med garanti
ER1025-56KR
- Delenummer:
- ER1025-56KR
- Produsent:
- API Delevan
- Beskrivelse:
- FIXED IND 33UH 130MA 3.4 OHM TH
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13800 Pieces
- Dataark:
- ER1025-56KR.pdf
Introduksjon
BYCHIPS er strømprodusenten for ER1025-56KR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for ER1025-56KR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | - |
|---|---|
| Toleranse: | ±10% |
| Leverandør Enhetspakke: | Axial |
| Størrelse / Dimensjon: | 0.095" Dia x 0.250" L (2.41mm x 6.35mm) |
| skjerming: | Unshielded |
| Serie: | Military, MIL-PRF-39010/10, ER1025 |
| rangeringer: | - |
| Q @ Freq: | 45 @ 2.5MHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Axial |
| Andre navn: | 1134-1232 1134-1232-2 1134-1232-2-MIL 1134-1232-MIL ER1025-56KR-250 TR ER102556KR |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens varenummer: | ER1025-56KR |
| induktans: | 33µH |
| Høyde - sittende (maks): | - |
| Frekvens - Test: | 2.5MHz |
| Frekvens - Selvresonans: | 24MHz |
| Utvidet beskrivelse: | 33µH Unshielded Inductor 130mA 3.4 Ohm Max Axial |
| Beskrivelse: | FIXED IND 33UH 130MA 3.4 OHM TH |
| DC-motstand (DCR): | 3.4 Ohm Max |
| Nåværende vurdering: | 130mA |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til ER1025-56KR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers