Kjøpe FDME1024NZT med BYCHPS
Kjøp med garanti
FDME1024NZT
- Delenummer:
- FDME1024NZT
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- MOSFET 2N-CH 20V 3.8A 6-MICROFET
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17760 Pieces
- Dataark:
- FDME1024NZT.pdf
Introduksjon
BYCHIPS er strømprodusenten for FDME1024NZT, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FDME1024NZT via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 1V @ 250µA |
|---|---|
| Leverandør Enhetspakke: | MicroFet 1.6x1.6 Thin |
| Serie: | PowerTrench® |
| Rds På (Maks) @ Id, Vgs: | 66 mOhm @ 3.4A, 4.5V |
| Strøm - Maks: | 600mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 6-UFDFN Exposed Pad |
| Andre navn: | FDME1024NZT-ND FDME1024NZTTR |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | FDME1024NZT |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 300pF @ 10V |
| Gateavgift (Qg) (Maks) @ Vgs: | 4.2nC @ 4.5V |
| FET Type: | 2 N-Channel (Dual) |
| FET-funksjonen: | Logic Level Gate |
| Utvidet beskrivelse: | Mosfet Array 2 N-Channel (Dual) 20V 3.8A 600mW Surface Mount MicroFet 1.6x1.6 Thin |
| Drain til Source Voltage (VDSS): | 20V |
| Beskrivelse: | MOSFET 2N-CH 20V 3.8A 6-MICROFET |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 3.8A |
| Email: | [email protected] |
Beslektede deler til FDME1024NZT
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers