Kjøpe FEPB6DTHE3/81 med BYCHPS
Kjøp med garanti
FEPB6DTHE3/81
- Delenummer:
- FEPB6DTHE3/81
- Produsent:
- Vishay / Semiconductor - Diodes Division
- Beskrivelse:
- DIODE ARRAY GP 200V 6A TO263AB
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12994 Pieces
Introduksjon
BYCHIPS er strømprodusenten for FEPB6DTHE3/81, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FEPB6DTHE3/81 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 975mV @ 3A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 200V |
| Leverandør Enhetspakke: | TO-263AB |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 35ns |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Driftstemperatur - Kobling: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 30 Weeks |
| Produsentens varenummer: | FEPB6DTHE3/81 |
| Utvidet beskrivelse: | Diode Array 1 Pair Common Cathode Standard 200V 6A Surface Mount TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Diodetype: | Standard |
| Diode Konfigurasjon: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE ARRAY GP 200V 6A TO263AB |
| Strøm - Omvendt lekkasje @ Vr: | 5µA @ 200V |
| Gjeldende - Gjennomsnittlig Rectified (Io) (per diode): | 6A |
| Email: | [email protected] |
Beslektede deler til FEPB6DTHE3/81
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers