Kjøpe FFVS6C0306K-- med BYCHPS
Kjøp med garanti
FFVS6C0306K--
- Delenummer:
- FFVS6C0306K--
- Produsent:
- AVX Corporation
- Beskrivelse:
- CAP FILM 30UF 10% 900VDC SCREW
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 15231 Pieces
- Dataark:
- FFVS6C0306K--.pdf
Introduksjon
BYCHIPS er strømprodusenten for FFVS6C0306K--, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FFVS6C0306K-- via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 900V |
|---|---|
| Spenningsverdier - AC: | - |
| Toleranse: | ±10% |
| Avslutning: | Screw Terminals |
| Størrelse / Dimensjon: | 3.327" Dia (84.50mm) |
| Serie: | FFVS |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 478-5824 FFVS6C0306K |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 17 Weeks |
| Produsentens varenummer: | FFVS6C0306K-- |
| Lead Spacing: | 1.772" (45.00mm) |
| Høyde - sittende (maks): | 1.378" (35.00mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 30µF ±10% Film Capacitor 900V Polypropylene (PP), Metallized Radial, Can |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 30UF 10% 900VDC SCREW |
| kapasitans: | 30µF |
| applikasjoner: | DC Link, DC Filtering |
| Email: | [email protected] |
Beslektede deler til FFVS6C0306K--
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers