Kjøpe FMG2G300US60E med BYCHPS
Kjøp med garanti
FMG2G300US60E
- Delenummer:
- FMG2G300US60E
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- IGBT MOLDING 600V 300A 7PM-HA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18475 Pieces
- Dataark:
- FMG2G300US60E.pdf
Introduksjon
BYCHIPS er strømprodusenten for FMG2G300US60E, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FMG2G300US60E via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.7V @ 15V, 300A |
| Leverandør Enhetspakke: | 7PM-HA |
| Serie: | - |
| Strøm - Maks: | 892W |
| Pakke / tilfelle: | 7PM-HA |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | FMG2G300US60E |
| Input Kapasitans (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Half Bridge 600V 300A 892W Chassis Mount 7PM-HA |
| Beskrivelse: | IGBT MOLDING 600V 300A 7PM-HA |
| Gjeldende - Samler Cutoff (Maks): | 250µA |
| Nåværende - Samler (Ic) (Maks): | 300A |
| konfigurasjon: | Half Bridge |
| Email: | [email protected] |
Beslektede deler til FMG2G300US60E
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers