Kjøpe FMR0H104ZF med BYCHPS
Kjøp med garanti
FMR0H104ZF
- Delenummer:
- FMR0H104ZF
- Produsent:
- KEMET
- Beskrivelse:
- CAPACITOR 0.1F 5.5V RADIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15635 Pieces
- Dataark:
- FMR0H104ZF.pdf
Introduksjon
BYCHIPS er strømprodusenten for FMR0H104ZF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for FMR0H104ZF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 5.5V |
|---|---|
| Toleranse: | -20%, +80% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 0.413" L x 0.256" W (10.50mm x 6.50mm) |
| Serie: | FM |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial |
| Andre navn: | 399-13102 USCFMR0H104Z00 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 26 Weeks |
| Produsentens varenummer: | FMR0H104ZF |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Høyde - sittende (maks): | 0.453" (11.50mm) |
| Utvidet beskrivelse: | 100mF -20%, +80%(EDLC) Supercapacitor 5.5V Radial 50 Ohm 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | 50 Ohm |
| Beskrivelse: | CAPACITOR 0.1F 5.5V RADIAL |
| kapasitans: | 100mF |
| Email: | [email protected] |
Beslektede deler til FMR0H104ZF
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MAL219691126E3 | Vishay BC Components | CAP ALUM 4F 8.4V SNAP | Forespørsel |
 |
KR-5R5V155-R | Eaton | CAP 1.5F -20% +80% 5.5V T/H | Forespørsel |
 |
HV1625-2R7256-R | Eaton | CAP 25F -10% +30% 2.7V T/H | Forespørsel |
 |
335DCN2R7MGJG | Illinois Capacitor | CAPACITOR 3.3F 20% 2.7V T/H | Forespørsel |
 |
JJC0E396MELZ | Nichicon | CAP 39F 20% 2.5V THROUGH HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers