Kjøpe G6CU-1117P-FD-US DC12 med BYCHPS
Kjøp med garanti
G6CU-1117P-FD-US DC12
- Delenummer:
- G6CU-1117P-FD-US DC12
- Produsent:
- Omron
- Beskrivelse:
- RELAY GEN PURPOSE SPST 10A 12V
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19181 Pieces
- Dataark:
- G6CU-1117P-FD-US DC12.pdf
Introduksjon
BYCHIPS er strømprodusenten for G6CU-1117P-FD-US DC12, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for G6CU-1117P-FD-US DC12 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 8.4 VDC |
|---|---|
| Slå av spenning (Min): | - |
| Oppsigelsesstil: | PC Pin |
| Bryter spenning: | 250VAC, 125VDC - Max |
| Serie: | G6C |
| Frigjør tid: | 10ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | G6CK1093F G6CU-1117P-FD-USDC12 G6CU1117PFDUS12DC G6CU1117PFDUSDC12 |
| Driftstemperatur: | -25°C ~ 70°C |
| Bruk tid: | 10ms |
| Monteringstype: | Through Hole |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | G6CU-1117P-FD-US DC12 |
| Egenskaper: | Sealed - Flux Protection |
| Utvidet beskrivelse: | General Purpose Relay SPST-NO (1 Form A) 12VDC Coil Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE SPST 10A 12V |
| Kontakt Rating (Nåværende): | 10A |
| Kontaktmateriale: | Silver Indium Tin (AgInSn) |
| Kontakt skjema: | SPST-NO (1 Form A) |
| Spolespenning: | 12VDC |
| Spole type: | Latching, Single Coil |
| Coil Resistance: | 720 Ohms |
| Coil Power: | 200 mW |
| Coil Current: | 16.7mA |
| Email: | [email protected] |
Beslektede deler til G6CU-1117P-FD-US DC12
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers