Kjøpe HB1030-2R5106-1 med BYCHPS
Kjøp med garanti
HB1030-2R5106-1
- Delenummer:
- HB1030-2R5106-1
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- CAP 10F -10%, +30% 2.5V T/HOLE
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13694 Pieces
- Dataark:
- HB1030-2R5106-1.pdf
Introduksjon
BYCHIPS er strømprodusenten for HB1030-2R5106-1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HB1030-2R5106-1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | -10%, +30% |
| Avslutning: | - |
| Størrelse / Dimensjon: | 0.394" Dia (10.00mm) |
| Serie: | PowerStor HB |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | HB1030-2R5106-1 |
| Levetid @ Temp.: | 1000 Hrs @ 70°C |
| Lead Spacing: | 0.197" (5.00mm) |
| Høyde - sittende (maks): | 1.220" (31.00mm) |
| Utvidet beskrivelse: | 10F -10%, +30%(EDLC) Supercapacitor 2.5V Radial, Can 60 mOhm 1000 Hrs @ 70°C |
| ESR (ekvivalent serieresistens): | 60 mOhm |
| Beskrivelse: | CAP 10F -10%, +30% 2.5V T/HOLE |
| kapasitans: | 10F |
| Email: | [email protected] |
Beslektede deler til HB1030-2R5106-1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
HB1030-2R5106-R | Eaton | CAP 10F -10% +30% 2.5V T/H | Forespørsel |
 |
BZ019B223ZSB | AVX Corporation | CAP 22MF -20% +80% 9V SMD | Forespørsel |
 |
XV3560-2R7407-R | Eaton | CAP 400F -5% +10% 2.7V T/H | Forespørsel |
 |
PHV-5R4H255-R | Eaton | CAP 2.5F -10% +30% 5.4V T/H | Forespørsel |
 |
PAS1020LA3R0405 | Taiyo Yuden | CAP 4F 20% 3V THROUGH HOLE | Forespørsel |
 |
JJC0E127MELB | Nichicon | CAP 120F 20% 2.5V THROUGH HOLE | Forespørsel |
 |
JUMT1475MHD | Nichicon | CAP 4.7F 20% 2.7V THROUGH HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers