Kjøpe HFW1131K00 med BYCHPS
Kjøp med garanti
HFW1131K00
- Delenummer:
- HFW1131K00
- Beskrivelse:
- HFW1131K00 = HFW 1/2 SIZE RELA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 18672 Pieces
- Dataark:
- HFW1131K00.pdf
Introduksjon
BYCHIPS er strømprodusenten for HFW1131K00, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HFW1131K00 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Andre navn: | 3-1617029-1 HFW1131K00-MIL |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | HFW1131K00 |
| Utvidet beskrivelse: | Relay |
| Beskrivelse: | HFW1131K00 = HFW 1/2 SIZE RELA |
| Email: | [email protected] |
Beslektede deler til HFW1131K00
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
HFW1131K05M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1130K06P | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1131K04M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1130K07M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1131K04P | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1131K04 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1130K06M | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
 |
HFW1130K06 | TE Connectivity Aerospace, Defense and Marine | RELAY GEN PURPOSE DPDT 2A 26.5V | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers