Kjøpe HFW1201G01M med BYCHPS
Kjøp med garanti
HFW1201G01M
- Delenummer:
- HFW1201G01M
- Beskrivelse:
- RELAY GEN PURPOSE DPDT 2A 12V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 12997 Pieces
- Dataark:
- HFW1201G01M.pdf
Introduksjon
BYCHIPS er strømprodusenten for HFW1201G01M, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HFW1201G01M via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 6.4 VDC |
|---|---|
| Slå av spenning (Min): | 0.7 VDC |
| Oppsigelsesstil: | PC Pin |
| Bryter spenning: | 28VDC - Nom |
| Serie: | Military, MIL-R-39016/6, HFW, CII |
| Frigjør tid: | 4ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | 1122-1128 1122-1128-MIL 2-1617030-7 A101693 A101693-ND HFW1201G01M-ND M39016/6-116M |
| Driftstemperatur: | -65°C ~ 125°C |
| Bruk tid: | 4ms |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | HFW1201G01M |
| Egenskaper: | Sealed - Hermetically |
| Utvidet beskrivelse: | General Purpose Relay DPDT (2 Form C) Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE DPDT 2A 12V |
| Kontakt Rating (Nåværende): | 2A |
| Kontaktmateriale: | - |
| Kontakt skjema: | DPDT (2 Form C) |
| Spolespenning: | 12VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 160 Ohms |
| Coil Power: | 900 mW |
| Coil Current: | 75mA |
| Email: | [email protected] |
Beslektede deler til HFW1201G01M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers