Kjøpe HVR30D3M0J med BYCHPS
Kjøp med garanti
HVR30D3M0J
- Delenummer:
- HVR30D3M0J
- Produsent:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- RES CHAS MNT 3M OHM 5% 50W
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14748 Pieces
- Dataark:
- 1.HVR30D3M0J.pdf2.HVR30D3M0J.pdf
Introduksjon
BYCHIPS er strømprodusenten for HVR30D3M0J, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for HVR30D3M0J via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±5% |
|---|---|
| Temperaturkoeffisient: | ±300ppm/°C |
| Størrelse / Dimensjon: | 1.181" Dia x 5.512" L (30.00mm x 140.00mm) |
| Serie: | HVR, CGS |
| Motstand (ohm): | 3M |
| Strøm (Watts): | 50W |
| emballasje: | Bulk |
| Pakke / tilfelle: | Axial, Tubular |
| Andre navn: | 1-1625953-3 1-1625953-3-ND |
| Driftstemperatur: | - |
| Monteringsfunksjon: | Brackets (not included) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | HVR30D3M0J |
| Lead Style: | Ferrule Ends (Ferrule Ends, M5 Thread) |
| Høyde - sittende (maks): | - |
| Egenskaper: | High Voltage, RF, High Frequency |
| Strykprosent: | - |
| Beskrivelse: | RES CHAS MNT 3M OHM 5% 50W |
| sammensetning: | Thick Film |
| Belegg, Boligtype: | Aluminum |
| Email: | [email protected] |
Beslektede deler til HVR30D3M0J
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers