Kjøpe L2K212BJ105MD-T med BYCHPS
Kjøp med garanti
L2K212BJ105MD-T
- Delenummer:
- L2K212BJ105MD-T
- Produsent:
- Taiyo Yuden
- Beskrivelse:
- CAP ARRAY 1.0UF 10V X5R 0805
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14576 Pieces
- Dataark:
- L2K212BJ105MD-T.pdf
Introduksjon
BYCHIPS er strømprodusenten for L2K212BJ105MD-T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for L2K212BJ105MD-T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 10V |
|---|---|
| Toleranse: | ±20% |
| Temperaturkoeffisient: | X5R |
| Størrelse / Dimensjon: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Serie: | - |
| rangeringer: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 0805 (2012 Metric) |
| Andre navn: | CE L2K212 BJ105MD-T |
| Antall kondensatorer: | 2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | L2K212BJ105MD-T |
| Høyde - sittende (maks): | 0.033" (0.85mm) |
| Utvidet beskrivelse: | 1µF ±20% Isolated Capacitor Array 10V X5R 0805 (2012 Metric) |
| Dielektrisk materiale: | Ceramic |
| Beskrivelse: | CAP ARRAY 1.0UF 10V X5R 0805 |
| Kretskort: | Isolated |
| kapasitans: | 1µF |
| Email: | [email protected] |
Beslektede deler til L2K212BJ105MD-T
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
W3A41A331KAT2A | AVX Corporation | CAP ARRAY 330PF 100V NP0 0612 | Forespørsel |
 |
L2K212BJ105KD-T | Taiyo Yuden | CAP ARRAY 1.0UF 10V X5R 0805 | Forespørsel |
 |
W2A45C472MAT2A | AVX Corporation | CAP ARRAY 4700PF 50V X7R 0508 | Forespørsel |
 |
CKCM25X8R1H221M060AL | TDK Corporation | CAP ARRAY 220PF 50V X8R 0504 | Forespørsel |
 |
105K250CS6-FA | Cornell Dubilier Electronics (CDE) | CAP NETWORK 1UF 250V 6DIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers