Kjøpe LGJ12575TS-470M2R7-H med BYCHPS
Kjøp med garanti
LGJ12575TS-470M2R7-H
- Delenummer:
- LGJ12575TS-470M2R7-H
- Produsent:
- TDK Corporation
- Beskrivelse:
- FIXED IND 47UH 3A 52.8 MOHM SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17105 Pieces
- Dataark:
- LGJ12575TS-470M2R7-H.pdf
Introduksjon
BYCHIPS er strømprodusenten for LGJ12575TS-470M2R7-H, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for LGJ12575TS-470M2R7-H via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Størrelse / Dimensjon: | 0.492" L x 0.492" W (12.50mm x 12.50mm) |
| skjerming: | Shielded |
| Serie: | LGJ |
| rangeringer: | AEC-Q200 |
| Q @ Freq: | - |
| emballasje: | Original-Reel® |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 445-15045-6 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 18 Weeks |
| Produsentens varenummer: | LGJ12575TS-470M2R7-H |
| induktans: | 47µH |
| Høyde - sittende (maks): | 0.295" (7.50mm) |
| Frekvens - Test: | 1kHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 47µH Shielded Wirewound Inductor 3A 52.8 mOhm Nonstandard |
| Beskrivelse: | FIXED IND 47UH 3A 52.8 MOHM SMD |
| DC-motstand (DCR): | 52.8 mOhm |
| Nåværende vurdering: | 3A |
| Nåværende - Metning: | 2.7A |
| Email: | [email protected] |
Beslektede deler til LGJ12575TS-470M2R7-H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers