Kjøpe M74HC365YTTR med BYCHPS
Kjøp med garanti
M74HC365YTTR
- Delenummer:
- M74HC365YTTR
- Produsent:
- ST
- Beskrivelse:
- IC HEX BUS BUFFER 3ST 16TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16193 Pieces
- Dataark:
- M74HC365YTTR.pdf
Introduksjon
BYCHIPS er strømprodusenten for M74HC365YTTR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for M74HC365YTTR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2 V ~ 6 V |
|---|---|
| Leverandør Enhetspakke: | 16-TSSOP |
| Serie: | Automotive, AEC-Q100, 74HC |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 16-TSSOP (0.173", 4.40mm Width) |
| Utgangstype: | Push-Pull |
| Andre navn: | 497-14391-2 |
| Driftstemperatur: | -55°C ~ 125°C (TA) |
| Antall elementer: | 1 |
| Antall bit per element: | 6 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | M74HC365YTTR |
| Logikk Type: | Buffer, Non-Inverting |
| Inngangstype: | - |
| Utvidet beskrivelse: | Buffer, Non-Inverting Element 6 Bit per Element Push-Pull Output 16-TSSOP |
| Beskrivelse: | IC HEX BUS BUFFER 3ST 16TSSOP |
| Nåværende - Utgang Høy, Lav: | 7.8mA, 7.8mA |
| Email: | [email protected] |
Beslektede deler til M74HC365YTTR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers