Kjøpe MAX14752EUE+T med BYCHPS
Kjøp med garanti
MAX14752EUE+T
- Delenummer:
- MAX14752EUE+T
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC MULTIPLEXER 8X1 16TSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12337 Pieces
Introduksjon
BYCHIPS er strømprodusenten for MAX14752EUE+T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAX14752EUE+T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Tilførsel, Enkel (V +): | 20 V ~ 72 V |
|---|---|
| Spenning - Forsyning, Dual (V ±): | ±10 V ~ 36 V |
| Bytt tid (Ton, Toff) (Maks): | 25µs, 2µs |
| Bytt krets: | - |
| Leverandør Enhetspakke: | 16-TSSOP |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 16-TSSOP (0.173", 4.40mm Width) |
| Andre navn: | MAX14752EUE+T-ND MAX14752EUE+TTR MAX14752EUET |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| On-State Resistance (Max): | 130 Ohm |
| Antall kretser: | 1 |
| Multiplexer / Demultiplekser Circuit: | 8:1 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | MAX14752EUE+T |
| Utvidet beskrivelse: | 1 Circuit IC Switch 8:1 130 Ohm 16-TSSOP |
| Beskrivelse: | IC MULTIPLEXER 8X1 16TSSOP |
| Nåværende - Lekkasje (IS (av)) (Maks): | 20nA |
| Crosstalk: | -62dB @ 100kHz |
| Charge Injection: | 200pC |
| Kanal-til-kanal-matching (ΔRon): | 500 mOhm |
| Kanalkapasitans (CS (av), CD (av)): | 3.7pF |
| -3db Båndbredde: | 20MHz |
| Email: | [email protected] |
Beslektede deler til MAX14752EUE+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers