Kjøpe MAX3085EPA med BYCHPS
Kjøp med garanti
MAX3085EPA
- Delenummer:
- MAX3085EPA
- Produsent:
- Maxim Integrated
- Beskrivelse:
- IC TXRX RS485/RS422 10MPBS 8-DIP
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 14788 Pieces
- Dataark:
- 1.MAX3085EPA.pdf2.MAX3085EPA.pdf
Introduksjon
BYCHIPS er strømprodusenten for MAX3085EPA, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MAX3085EPA via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 4.75 V ~ 5.25 V |
|---|---|
| Type: | Transceiver |
| Leverandør Enhetspakke: | 8-PDIP |
| Serie: | - |
| Mottaker Hysterese: | 100mV |
| protokoll: | RS422, RS485 |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-DIP (0.300", 7.62mm) |
| Andre navn: | Q1152458 |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall drivere / mottakere: | 1/1 |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MAX3085EPA |
| Utvidet beskrivelse: | 1/1 Transceiver Half RS422, RS485 8-PDIP |
| duplex: | Half |
| Beskrivelse: | IC TXRX RS485/RS422 10MPBS 8-DIP |
| Datahastighet: | 500kbps |
| Email: | [email protected] |
Beslektede deler til MAX3085EPA
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers