Kjøpe NC7SP126FHX med BYCHPS
Kjøp med garanti
NC7SP126FHX
- Delenummer:
- NC7SP126FHX
- Produsent:
- Fairchild/ON Semiconductor
- Beskrivelse:
- IC BUFFER ULP 3STATE 6-MICROPAK2
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12972 Pieces
- Dataark:
- NC7SP126FHX.pdf
Introduksjon
BYCHIPS er strømprodusenten for NC7SP126FHX, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NC7SP126FHX via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 0.9 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 6-MicroPak2™ |
| Serie: | 7SP |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 6-UFDFN |
| Utgangstype: | Push-Pull |
| Andre navn: | NC7SP126FHX-ND NC7SP126FHXTR |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall elementer: | 1 |
| Antall bit per element: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | NC7SP126FHX |
| Logikk Type: | Buffer, Non-Inverting |
| Inngangstype: | - |
| Utvidet beskrivelse: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output 6-MicroPak2™ |
| Beskrivelse: | IC BUFFER ULP 3STATE 6-MICROPAK2 |
| Nåværende - Utgang Høy, Lav: | 2.6mA, 2.6mA |
| Email: | [email protected] |
Beslektede deler til NC7SP126FHX
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers