Kjøpe NS7520B-1-I46 med BYCHPS
Kjøp med garanti
NS7520B-1-I46
- Delenummer:
- NS7520B-1-I46
- Produsent:
- Digi International
- Beskrivelse:
- IC ARM MICROPROCESSOR 177BGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14271 Pieces
Introduksjon
BYCHIPS er strømprodusenten for NS7520B-1-I46, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NS7520B-1-I46 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 1.4 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 177-BGA (13x13) |
| Serie: | NET+ARM® |
| RAM-størrelse: | External |
| Programminnetype: | External Program Memory |
| emballasje: | Tray |
| Pakke / tilfelle: | 177-LFBGA |
| Andre navn: | 602-1419 NS7520B-1-I46-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall I / O: | 16 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | NS7520B-1-I46 |
| Interface: | EBI/EMI, Ethernet, DMA, SPI, UART |
| Beskrivelse: | IC ARM MICROPROCESSOR 177BGA |
| Kjerneprosessor: | ARM7® |
| Controller Series: | - |
| applikasjoner: | Network Processor |
| Email: | [email protected] |
Beslektede deler til NS7520B-1-I46
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
NS7520B-1-C36 | Digi International | IC ARM MICROPROCESSOR 177BGA | Forespørsel |
 |
TLE98422QXXUMA1 | Infineon Technologies | EMBEDDED POWER | Forespørsel |
|
NS7520B-1-I55 | Digi International | IC ARM MICROPROCESSOR 177BGA | Forespørsel |
|
NS7520B-1-C55 | Digi International | IC ARM MICROPROCESSOR 177BGA | Forespørsel |
 |
NET+50-BINP | Digi International | IC ARM7 MPU 32BIT 208BGA | Forespørsel |
 |
AT97SC3204-U4A14-10 | Microchip Technology | IC CRYPTO TPM LPC 28TSSOP | Forespørsel |
 |
MM912G634CV2APR2 | NXP USA Inc. | IC MCU 16BIT 48KB FLASH 48LQFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers