Kjøpe PAS0815LS2R5105 med BYCHPS
Kjøp med garanti
PAS0815LS2R5105
- Delenummer:
- PAS0815LS2R5105
- Produsent:
- Taiyo Yuden
- Beskrivelse:
- CAP 1F 20% 2.5V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13399 Pieces
Introduksjon
BYCHIPS er strømprodusenten for PAS0815LS2R5105, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PAS0815LS2R5105 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.5V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | LS |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 587-3464 587-3464-1 587-3464-1-ND CP PAS0815LS2R5105 |
| Driftstemperatur: | -25°C ~ 70°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | PAS0815LS2R5105 |
| Levetid @ Temp.: | - |
| Lead Spacing: | 0.138" (3.50mm) |
| Høyde - sittende (maks): | 0.669" (17.00mm) |
| Utvidet beskrivelse: | 1F ±20%(EDLC) Supercapacitor 2.5V Radial, Can 70 mOhm |
| ESR (ekvivalent serieresistens): | 70 mOhm |
| Beskrivelse: | CAP 1F 20% 2.5V THROUGH HOLE |
| kapasitans: | 1F |
| Email: | [email protected] |
Beslektede deler til PAS0815LS2R5105
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PAS0815LA2R3185 | Taiyo Yuden | CAP 1.8F 20% 2.3V THROUGH HOLE | Forespørsel |
 |
PAS0815LR2R3105 | Taiyo Yuden | CAP 1F 20% 2.3V THROUGH HOLE | Forespørsel |
 |
PAS0815LN2R7205 | Taiyo Yuden | CAP 2F 20% 2.7V THROUGH HOLE | Forespørsel |
 |
TV1325-3R0156-R | Eaton | CAP, 3.0V, 15F | Forespørsel |
 |
706DCR2R3SKY | Illinois Capacitor | CAP 70F -20%, +50% 2.3V T/H | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers