Kjøpe PAS1840LA2R3566 med BYCHPS
Kjøp med garanti
PAS1840LA2R3566
- Delenummer:
- PAS1840LA2R3566
- Produsent:
- Taiyo Yuden
- Beskrivelse:
- CAP 56F 20% 2.3V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14123 Pieces
- Dataark:
- PAS1840LA2R3566.pdf
Introduksjon
BYCHIPS er strømprodusenten for PAS1840LA2R3566, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PAS1840LA2R3566 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.3V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.709" Dia (18.00mm) |
| Serie: | LA |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 587-2020 |
| Driftstemperatur: | -25°C ~ 60°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | PAS1840LA2R3566 |
| Levetid @ Temp.: | - |
| Lead Spacing: | 0.315" (8.00mm) |
| Høyde - sittende (maks): | 1.654" (42.00mm) |
| Utvidet beskrivelse: | 56F ±20%(EDLC) Supercapacitor 2.3V Radial, Can 70 mOhm |
| ESR (ekvivalent serieresistens): | 70 mOhm |
| Beskrivelse: | CAP 56F 20% 2.3V THROUGH HOLE |
| kapasitans: | 56F |
| Email: | [email protected] |
Beslektede deler til PAS1840LA2R3566
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PAS1840LA3R0506 | Taiyo Yuden | CAP 50F 20% 3V THROUGH HOLE | Forespørsel |
 |
MAL222091004E3 | Vishay BC Components | EDLC-P 25F-2.7V-1820- POWER | Forespørsel |
 |
JJC0E826MELB | Nichicon | CAP 82F 20% 2.5V THROUGH HOLE | Forespørsel |
 |
JJD0E238MSEFBB | Nichicon | CAP 2300F 20% 2.5V CHASSIS MOUNT | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers