Kjøpe QSZ1TR med BYCHPS
Kjøp med garanti
QSZ1TR
- Delenummer:
- QSZ1TR
- Produsent:
- LAPIS Semiconductor
- Beskrivelse:
- TRANS NPN/PNP 15V 2A 5TSMT
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17588 Pieces
- Dataark:
- QSZ1TR.pdf
Introduksjon
BYCHIPS er strømprodusenten for QSZ1TR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for QSZ1TR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 15V |
|---|---|
| Vce Metning (Maks) @ Ib, Ic: | 180mV @ 50mA, 1A |
| Transistor Type: | NPN, PNP (Emitter Coupled) |
| Leverandør Enhetspakke: | TSMT5 |
| Serie: | - |
| Strøm - Maks: | 500mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SOT-23-5 Thin, TSOT-23-5 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | QSZ1TR |
| Frekvens - Overgang: | 360MHz |
| Utvidet beskrivelse: | Bipolar (BJT) Transistor Array NPN, PNP (Emitter Coupled) 15V 2A 360MHz 500mW Surface Mount TSMT5 |
| Beskrivelse: | TRANS NPN/PNP 15V 2A 5TSMT |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 270 @ 200mA, 2V |
| Gjeldende - Samler Cutoff (Maks): | 100nA (ICBO) |
| Nåværende - Samler (Ic) (Maks): | 2A |
| Email: | [email protected] |
Beslektede deler til QSZ1TR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SMBT3904UPNE6327HTSA1 | Infineon Technologies | TRANS NPN/PNP 40V 0.2A SC74-6 | Forespørsel |
 |
2N2652A | Central Semiconductor Corp | TRANS 2NPN 500MA 60V TO78-6 | Forespørsel |
 |
CMXT2207 TR | Central Semiconductor Corp | TRANS NPN/PNP 600MA SOT26 | Forespørsel |
 |
PMP5201Y,135 | Nexperia USA Inc. | TRANS 2PNP 45V 0.1A 6TSSOP | Forespørsel |
|
HN1B01FDW1T1G | ON Semiconductor | TRANS NPN/PNP 50V 0.2A SC74 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers