Kjøpe RSE500212 med BYCHPS
Kjøp med garanti
RSE500212
- Delenummer:
- RSE500212
- Produsent:
- Amphenol Pcd
- Beskrivelse:
- SMITHS, LC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19679 Pieces
- Dataark:
- RSE500212.pdf
Introduksjon
BYCHIPS er strømprodusenten for RSE500212, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RSE500212 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Serie: | * |
|---|---|
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | RSE500212 |
| Utvidet beskrivelse: | Relay |
| Beskrivelse: | SMITHS, LC |
| Email: | [email protected] |
Beslektede deler til RSE500212
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
RSE500501 | Amphenol PCD | SMITHS, WC, NO HW | Forespørsel |
|
RSE500315 | Amphenol PCD | SMITHS, LC | Forespørsel |
|
RSE500412 | Amphenol PCD | SMITHS, LC | Forespørsel |
|
RSE500413 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500503 | Amphenol PCD | SMITHS, WC, NO HW | Forespørsel |
|
RSE500201 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500211 | Amphenol PCD | SMITHS, LC | Forespørsel |
|
RSE500314 | Amphenol PCD | SMITHS, LC | Forespørsel |
|
RSE500411 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500509 | Amphenol PCD | SMITHS, WC, NO HW | Forespørsel |
|
RSE500507 | Amphenol PCD | SMITHS, WC, NO HW | Forespørsel |
|
RSE500311 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500302 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500301 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500202 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500316 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500402 | Amphenol PCD | SMITHS | Forespørsel |
|
RSE500414 | Amphenol PCD | SMITHS | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers